Electronics and Assembly Solutions
01Reactive Hot Melt Adhesives
Feature and Benefits
- Robust, tough, single-component construction
- Near instantaneous bond strength
- Adhesion to a wide variety of substrates
- Resistance to chemicals, fuels and oils
- Low MVTR (superior moisture resistance)
- Formation of a resilient, tough polymer after cure, but can also be flexible
- Ultra fast curing materials available
02Low Temperature Cure Adhesives
Feature and Benefits
- One part, premixed, adhesives with long RT work life
- Long product shelf life at -20°C storage or below
- Industry-leading, thermal cure kinetics, offering lower temperature cure at short cure time
- High adhesion to a variety of substrates, including glass, metals and common low temperature stability plastics, such as PC, LCP, PA, PBT, ABS, PPA and different solder masked FR4
- High reliability and thermal resistance
- Low stress
- Easy processing liquid paste and _lm solutions
- High elongation
- Controlled Low solutions
03Light Curable Adhesives
Feature and Benefits
- A variety of viscosity options to meet a range of application conditions
- Products specially formulated for adhesion to metal, ceramic, glass, plastic, PC, and PVC
- Fast cure for capability in high-speed production
- Excellent end-use performance across a broad scope of application
04Structural Bonding Adhesives
Feature and Benefits
- Exceptional adhesion to similar and dissimilar substrates
- Tough construction, good impact resistance
- A variety of curing options, such as heat, moisture, UV, or a combination
- Solvent-free formulations
- Halogen-free formulations
- Dimensional stability
- High peel strength
- Low odor with no out-gassing
- Fast, 100% complete cure
- Outstanding chemical resistance
- Materials available to meet specifications such as UL, NSF, etc.
05Film Adhesives
Feature and Benefits
- Easy-to-use lm form
- No messy application equipment
- Immediate handling strength
- Low temperature application
- Reactive, cross-linking durability
- High strength and elongation
06Print Circuit Board (PCB) Materials
Feature and Benefits
- High reliability (drop, shock, autoclave and temperature cycle)
- Fast ow and easy processing
- Reworkability versus reliability balance
- Excellent flux compatibility
- High reliability edgebonds (replacing full underfill)
- Good SIR (Surface Insulation Resistance)
07Circuit Board Protection and Encapsulation
Feature and Benefits
- High reliability and environmental protection
- One or two part systems
- Different cure chemistries
- Thermal
- UV/ Light
- UV + Thermal
- UV + Moisture
- RTV (moisture cure)
- Low Shrinkage
- High TGs
- Low CTEs
- Low pro le heights
- Easy processing