Electronics and Assembly Solutions

01Reactive Hot Melt Adhesives

Feature and Benefits

  • Robust, tough, single-component construction
  • Near instantaneous bond strength
  • Adhesion to a wide variety of substrates
  • Resistance to chemicals, fuels and oils
  • Low MVTR (superior moisture resistance)
  • Formation of a resilient, tough polymer after cure, but can also be flexible
  • Ultra fast curing materials available
Structural Bonding Adhesives

02Low Temperature Cure Adhesives

Feature and Benefits

  • One part, premixed, adhesives with long RT work life
  • Long product shelf life at -20°C storage or below
  • Industry-leading, thermal cure kinetics, offering lower temperature cure at short cure time
  • High adhesion to a variety of substrates, including glass, metals and common low temperature stability plastics, such as PC, LCP, PA, PBT, ABS, PPA and different solder masked FR4
  • High reliability and thermal resistance
  • Low stress
  • Easy processing liquid paste and _lm solutions
  • High elongation
  • Controlled Low solutions

03Light Curable Adhesives

Feature and Benefits

  • A variety of viscosity options to meet a range of application conditions
  • Products specially formulated for adhesion to metal, ceramic, glass, plastic, PC, and PVC
  • Fast cure for capability in high-speed production
  • Excellent end-use performance across a broad scope of application

04Structural Bonding Adhesives

Feature and Benefits

  • Exceptional adhesion to similar and dissimilar substrates
  • Tough construction, good impact resistance
  • A variety of curing options, such as heat, moisture, UV, or a combination
  • Solvent-free formulations
  • Halogen-free formulations
  • Dimensional stability
  • High peel strength
  • Low odor with no out-gassing
  • Fast, 100% complete cure
  • Outstanding chemical resistance
  • Materials available to meet specifications such as UL, NSF, etc.
Structural Bonding Adhesives

05Film Adhesives

Feature and Benefits

  • Easy-to-use lm form
  • No messy application equipment
  • Immediate handling strength
  • Low temperature application
  • Reactive, cross-linking durability
  • High strength and elongation

06Print Circuit Board (PCB) Materials

Feature and Benefits

  • High reliability (drop, shock, autoclave and temperature cycle)
  • Fast ow and easy processing
  • Reworkability versus reliability balance
  • Excellent flux compatibility
  • High reliability edgebonds (replacing full underfill)
  • Good SIR (Surface Insulation Resistance)
  • Print Circuit Board (PCB) Materials
  • Print Circuit Board (PCB) Materials
  • Print Circuit Board (PCB) Materials

07Circuit Board Protection and Encapsulation

Feature and Benefits

  • High reliability and environmental protection
  • One or two part systems
  • Different cure chemistries
  • Thermal
  • UV/ Light
  • UV + Thermal
  • UV + Moisture
  • RTV (moisture cure)
  • Low Shrinkage
  • High TGs
  • Low CTEs
  • Low pro le heights
  • Easy processing